Students from Peru, Brazil, Argentina, Chile, Colombia and Bolivia and experts from 13 countries in Europe and America will participate in Intercon 2016, which will take place from the 2nd to the 5th august at the Piura Campus.
The XXIII International Congress of Electronical Engineering and Computing (Intercon 2016) includes conferences (plenaries), workshops, fairs, technical visits and talks. In addition to, diverse competitions such as: sumo and mini-sumo, Robot soccer, warbot, drones, Battle robot, lego and others. Inscriptions will be closed on august the 2nd.
Presentations will be under the charge of more than 40 professional experts from institutions of more than 13 countries of the world such as: David Golberg and David B. Durocher, from United States; Massimo Pompili from Italy, Luigi del Re from Austria; Guilherme Vianna from Brazil, William Thielicke from Germany, Avi Roman Gonzalez from Peru; among others.
Intercon is organised by the Student Branch IEEE (Institute of Electrical Engineering and Electronics) from Universidad de Piura and the Peruvian branch of the IEEE, with support by different collaborating committees. Will gather students, academics and business people from different parts in the country and from overseas.
The aim of this international meeting, that seeks to gather more than 1500 people, is to promote the exchange and generation of ideas, such as the promotion of research and exchange of experiences on Electronical Engineering, Electronics and Computing, acquired at the different educational institutions in the country and in the world.
The topics and the reflections of Intercon 2016 are of great interest, specially due to the importance of research and innovation for the economic growth produced in Latin-America in the last years.
The attendees, will be able to participate in talks, fairs, workshops and contests, and can also sign for technical visits that different companies from the region will be giving: Sinersa, Miski Mayo, Ecosac, Limones piuranos, DSM Marine lipids, Textil Piura, Caña Brava and others.
Information of Interest
- Inscriptions to attend the Intercon and participate on the competitions will be closed on the 2nd of august.
- If you wish to perform technical visits, you can register until July the 30th. Places are limited.
- Companies will be able to register for the Technological fair, only until July the 29th.
- Cost of inscriptions: for students: 230 peruvian soles; professionals 430, if not members of IEEE.
- For more information visit this link
- There will be more than 40 exhibitors from Latinamerica, Europe and United States.
Source: Universidad de Piura